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Y. Yamamoto et al., “High Power Test for Plug-compatible STF-type Power Coupler for ILC”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 199-204.
M. Warren et al., “Development of Hybrid Superconducting Photocathodes on Niobium Using High QE Coatings”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 205-209.
C. O. Choi, H. Jang, H. C. Jung, D. Y. Lee, and K. T. Son, “Development of 81.25 MHz 20 kW SSPA for RAON Accelerator”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 210-212.
K. T. Son, C. O. Choi, H. Jang, H. C. Jung, and D. Y. Lee, “Development of 4-way 81.25 MHz 20 kW High Power Combiner Using Parallel Plate Structure”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 213-215.
J. Zhao, S. Zhang, and Z. Z. Zhou, “Quench Protection in Digital Power Supplies for Superconducting Magnets in ADS”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 233-234.
T. M. Huang et al., “The Improvement of the Power Coupler for CADS SC Spoke Cavities”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 220-222.
F. Meng et al., “The Recent Research of HOM Damper for Superconducting Cavity in IHEP”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 223-226.
L. Chen et al., “The Development of the LLRF Control System for the New High Power Test Stand of Couplers”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 227-230.
C. Zhang et al., “Analysis of Higher Order Modes of the Superconducting Cavities for the China-ADS Injector-II in IMP”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 231-232.
T. M. Huang, Q. Ma, J. Y. Zhai, and K. X. Gu, “Design of the High Power Input Coupler for CEPC Main Ring Cavity ”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 216-219.
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